teknics at Hispack 2024
On May 7th, Hispack 2024 gets started. It is one of the most important Packaging trade fairs, where you can find innovative solutions, new technologies, new sustainable materiaIs and much more.
In teknics we make tailor made automated state-of-the-art solutions for demanding (some regulated) sectors such as Cosmetics, Medical, Phama, Electronics and the Food sector. We will showcase our AI Putwall, an innovative solution that will enhance your picking processes, allowing for an easy adoption of the technology, even with new future products never shown to the system before. Come and see by yourself!
teknics will gladly be present as an exhibitor at Stand 237 (Stand 1 of the Collaborate Space) in Hall 3.
Holding 2 pavilions, Hispack 2024 is expected to welcome more than 27,000 visitors and 720 exhibitors, including professionals from:
• Automation and Robotics
• 1ndustrial PacKaging
• Labelling and Bottling
• PacKaging and Processing Machinery
The exhibitor can be found at stand 237 (Stand 1 of the Collaborate Space), in the central part of Hall 3.
AI PUTWALL: “Pick anything without training”.
teknics proposes the next generation of BIN PICKING by adding an AI layer to a vision system that combines 2D and 3D images; this brings competitive advantages compared to any other solutions in the market. This novelty in image processing makes it possible to differentiate OBJECTS which have never been shown to the system before: it can just identify and pick anything seen by the camera for the first time, creating, and sending all the necessary information to the robot to operate seamlessly.
The extensive applications for this picking system depend on your needs and imagination, enhancing any process requiring random picking from bulk, no matter how many different parts (geometries, size, color…) are to be picked. With traditional solutions, the system would have to be trained in each of these different parts independently, consuming valuable time and resources at the customer’s end. This can be of course combined with additional functions such as RFID reading to segregate or classify products in different drop points or adding secondary operations (labeling, marking, transforming, etc.) as needed.
This is why teknics at Hispack wants to present the IA PUTWALL solution as a direct application of these combined technologies, making your process engineering easier and reduce operational costs.
In this edition, you will met Ramon Falip (R+D+I Manager), Jordi Carmona (Business Development Manager) and Aleix Morera (Sales Manager) at our stand. You will be more than welcome to pay us a visit so they can share the insights of this system and clarify any doubts you might have about this or any other solution we offer to the Packaging sector.
FAQS teknics at Hispack 2024
• When will Hispack 2024 be held?
Hispack 2024 will be held from 7-10 May 2024
• Where will Hispack be held?
Hispack 2024 will be held at the Gran Via de Barcelona exhibition centre (Fira de Barcelona).
• What will be exhibited at Hispack?
The latest developments in the Packaging sector with both national and international companies from the Packaging, Packaging and Bottling, and Machinery, Automation and Robotics sectors.
• Exhibitor catalogue?
https://ecatalogue.firabarcelona.com/hispack2024/home?filter=ONLY_EXHIBITORS&lang=ca_ES
• Where will teknics be located?
Stand 237 of Hall 3 (Stand 1 Collaborate Area)
• If you would like to visit us, please write to us at the following address: jcarmona@teknics.eu
